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SMT Assembly

Surface-Mount Technology assembly for high-density, high-reliability LED driver and control circuit boards.

SMT assembly line producing LED driver circuit boards

Electronics Manufacturing

Advanced SMT Production

Our SMT (Surface-Mount Technology) assembly line represents the core of our electronics manufacturing capability. Using high-speed Fuji pick-and-place machines, we populate printed circuit boards with precision components at remarkable speeds while maintaining placement accuracy that meets IPC Class 3 standards. This automated process ensures that every LED driver, dimming module, and control interface PCB delivers consistent electrical performance.

The complete SMT process includes solder paste application, automated component placement, reflow soldering in nitrogen-atmosphere ovens, and automated optical inspection (AOI). This closed-loop quality approach catches defects at every stage, ensuring that only fully verified boards proceed to final assembly. The result is driver electronics that perform reliably across the rated temperature range and service life of every REIZ luminaire.

SMT Process Steps

Solder paste application
Fuji pick & place machines
Reflow soldering (N2 atmosphere)
Automated Optical Inspection (AOI)
IPC Class 3 compliance
Component traceability
ESD-protected environment
In-circuit testing (ICT)